Raymond T. Tung

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Research Interests

  • Modification of schottky barrier height at metal-semiconductor interfaces by the formation of interlayers
  • combining UHV and Liquid Phase (CULP) processing of nanoparticles and interfaces
  • soft contact formation by printing in ultrahigh vacuum
  • a chemical perspective of the formation of band-offset and molecular level alignment at solid interfaces
  • schottky barrier height

Contact

Affiliated Campus(es)

  • Brooklyn College
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Contact

Affiliated Campus(es)

  • Brooklyn College